Company Introduction

Founded in 1997, KOSTECSYS is the first company in Korea to develop and mass-produce low thermal expansion, high heat dissipation materials for next-generation power semiconductors.
[Core Competency]
KOSTECSYS specializes in advanced thermal management components for SiC and GaN power semiconductor applications. Our proprietary material brand KCMC offers exceptional thermal conductivity with low thermal expansion, playing a critical role in heat dissipation, reliability, durability, and safety of next-generation semiconductor devices.
[Product Portfolio]

KCMC High Heat Dissipation Materials
Copper Pin and Copper Pillar
Thermal Matched Lead Frame
Air Cavity Packages
KCMC and Copper Base Plate (Pin Fin / Flat Type)
Photonic Integrated Circuit (PIC) Packages
Liquid Cold Plate and Cooling Block
LD Packages for Laser Modules
Current Sensor Shunt Resistors

[Competitive Advantages]

First in Korea to develop and commercialize low thermal expansion, high heat dissipation materials (Since 1997)
Proprietary KCMC material technology with proven mass-production capabilities
Global supply track record in SiC/GaN power semiconductor sector
Advanced Block Bonding packaging technology replacing traditional wire bonding
Two manufacturing plants in Incheon, South Korea
KOSDAQ-listed company (Stock Code: 355150)

[Target Industries]
Power Semiconductors, EV/HEV, Renewable Energy, 5G/RF Communications, Laser and Photonics, Industrial Power Electronics
Through continuous innovation, exceptional quality, and rapid response to customer needs, KOSTECSYS is committed to becoming a global leader in high heat dissipation materials for next-generation semiconductors.